Elsevier

Scripta Materialia

Volume 190, 1 January 2021, Pages 69-74
Scripta Materialia

A powder-metallurgy-based fabrication route towards achieving high tensile strength with ultra-high ductility in high-entropy alloy

https://doi.org/10.1016/j.scriptamat.2020.08.038Get rights and content

Abstract

The strength-ductility trade-off dilemma is perennially problematic in the materials science community. In particular, the attainability of high tensile strength and large elongation is ambitious in alloys fabricated by powder metallurgy. Here, we demonstrate a powder-metallurgy-based fabrication route to achieve a high synergy of tensile strength and ductility through cold-consolidation of CoCrFeMnNi high-entropy alloy powder using high-pressure torsion followed by annealing. This approach has resulted in an exceptional synergy of high yield strength of 754 MPa with an ultra-high tensile elongation of 58%% which has never been achieved in alloys fabricated by powder metallurgy routes. Additionally, the microstructure can be tuned by annealing treatment to achieve a range of strength and ductility that are highly sought after in industries for a specific application. The present fabrication route can be applied for fabrication of high-entropy alloy-matrix composites using alloys, metals, and ceramic powders to achieve controllable microstructure and eminent tensile properties.

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Declaration of Competing Interest

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Acknowledgments

This investigation was supported by the Creative Materials Discovery Program through the National Research Foundation of Korea (NRF; 2016M3D1A102338), and Ministry of Trade, Industry and Energy of Korea (20000495). Dr. S. Praveen was supported by the Korea Research Fellowship Program through the National Research Foundation of Korea (NFR; 2917H1D3A1A01013666). We would like to appreciate advisory from Dr. Manogna Karthik Gangaraju and Jeong Min Park from POSTECH.

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