Paper

  • Home
  • Publication
  • Paper
Semi-solid brazing via CoCrFeNiCux high-entropy alloy fillers: interfacial microstructure, mechanical properties, and joining mechanism of C/C-SiC composites and TZM alloy

Author Wenlong Zhou, Wei Fu, Yanxing Wang, Zuorui Gao, Shengpeng Hu, Xiaoguo Song, Hyoung Seop Kim & Jicai Feng

Publisher Advanced Composites and Hybrid Materials

Date 202605